Very clean and in beautiful condition as shown in the photographs. This controller and valve set for C4F8 Gas came from a TEL Tokyo Electron T-3044SS Etcher system that we are parting out. The system came out of a class 100 clean room, nanofabrication facility and was crate-stored in working condition before being released as surplus.
The Fujikin FCS line specifically uses a pressure-based sonic/choked flow design (critical expansion condition) combined with a highly precise piezo actuator control valve. It’s highly immune to upstream pressure spikes and crosstalk across gas blocks.
All Fujikin parts have been sealed since removal and will stay sealed during storage and shipment.
Hassle-Free Warranty.
Product Description
The Fujikin FCS-4WS-F122B is a premier, cleanroom-grade Flow Control System (FCS) designed explicitly for high-selectivity, high-aspect-ratio etching loops within semiconductor processing equipment. Utilizing a specialized pressure-based sonic/choked flow architecture (critical expansion condition), this system maintains extreme flow rate stability and accuracy, completely isolating process parameters from manifold cross-talk or pressure fluctuations. Factory-calibrated for Octafluorocyclobutane (C4F8) gas chemistry, the module features high-purity electropolished gas paths, an ultra-responsive piezoelectric actuator control valve, and a gas-tight metal seal design to prevent external leakage or atmospheric micro-contamination.
Surplus Condition Note: This high-purity mass flow control module was professionally extracted from an active Tokyo Electron (TEL) etcher tool operated exclusively inside a pristine, high-classification semiconductor cleanroom environment. The unit is cosmetically immaculate, free from typical industrial residues, and handled with strict adherence to purity preservation.
Technical Specifications
- Model Number: FCS-4WS-F122B
- Manufacturer: Fujikin Incorporated (Japan)
- Control Architecture: Sonic/Choked Flow Control System (Pressure-Based)
- Process Gas Tuning: C4F8 (Octafluorocyclobutane Oxide Etch Gas)
- Max Flow Rate: 1,000 SCCM
- Actuation Control: High-speed, solid-state Piezoelectric control valve
- Seal Architecture: High-purity, ultra-low leak metal seal standard
- Mounting Configuration: Modular Surface Mount / Integrated Gas System (IGS) Standard
- Application History: Reclaimed directly from a pristine cleanroom Tokyo Electron process tool manifold array
